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Intel 18A process node beats TSMC 2nm on power efficiency in independent tests

Third-party benchmarks published by Anandtech show Intel's in-house fabrication has closed the gap with Taiwan's leading foundry, raising questions about outsourcing strategies.

4 min read
Tessa GreenSemiconductors reporter
Silicon wafer on manufacturing equipment
Photo: Unsplash

Third-party benchmarks published by Anandtech show Intel's in-house fabrication has closed the gap with Taiwan's leading foundry, raising questions about outsourcing strategies.

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